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  1. Allegro MicroSytems, LLC Announces New 240 kHz Bandwidth, High-Precision, Field Progr
  2. Rambus Announces Silicon-proven R+ DDR4 PHY on GLOBALFOUNDRIES 14nm LPP Process for N
  3. Cadence Launches Tensilica Fusion G3 DSP Featuring Exceptional Out-of-the-Box Perform
  4. Western Digital Announces World’s First 64 Layer 3D NAND Technology
  5. Cree Expands into New Industrial High Bay Applications with HXB Series
  6. TI announces the only Qi-certified 15-W wireless power transmitter
  7. New Cypress Automotive LED Driver Delivers Robust Performance and Minimizes the Bill-
  8. Actions Semiconductor Launches the S900VR and the V700 28-nm Chipsets for Virtual Rea
  9. Philips to Expand Digital Health with Wellcentive
  10. AT&T Unveils New IoT Starter Kit for Developers
  11. Accenture Launches Liquid Studio in France to Help Organizations Accelerate Digital T
  12. Montage Rolls Out the World's First Gen2+ DDR4 RCD Capable of DDR4-3200
  13. Linksys India launches new and powerful Wireless Range Extenders
  14. Synopsys Expands DesignWare MIPI IP Portfolio with DSI and CSI-2 Device Controllers
  15. TRIAC-Dimmable LYTSwitch-7 LED Driver ICs From Power Integrations Cut BOM Count by 40
  16. Littelfuse Introduces Two Series of 0.5pF, 12kV TVS Diode Arrays Designed to Prevent
  17. Broadcom First to Sample Industry-Standard NVMe over Fibre Channel HBA Solution
  18. IXYS Introduces 1200V SiC Power MOSFET in SOT227 MiniBLOC Packages for Higher Power A
  19. Synopsys' IC Validator Certified by TowerJazz for Signoff Physical Verification
  20. Toshiba Launches Photorelays in DIP8 Packages with Industry-Leading 5A Drive Current
  21. TI introduces the industry's fastest isolated gate driver for high-voltage applicatio
  22. New IDT 12-Output Clock Generator Delivers Best-In-Class Jitter Performance for Today
  23. Toshiba Launches New ICs for Bluetooth® Smart Devices with Industry-Leading-Class Low
  24. Next-Generation Dual-Mode Bluetooth® Audio Products from Microchip
  25. Synopsys' New USB 2.0 Type-C IP Cuts Power and Area for IoT Edge Applications
  26. Lumileds Introduces LUXEON Stylist Series, the Industry’s Only LEDs with Specialized
  27. SiFive Introduces Industry's First Open-Source Chip Platforms
  28. SiFive Introduces Industry's First Open-Source Chip Platforms
  29. TI launches the first DDR memory-termination linear regulator for space applications
  30. Grandstream Releases a New Enterprise Gigabit Router and Managed Wi-Fi Access Point f
  31. STMicroelectronics Releases Development Ecosystem and Adds New Devices in Low-Power S
  32. Cypress Simplifies Embedded System Design with New Low-Pin-Count HyperRAM™ Memory
  33. Skyworks Expands Antenna Tuning Portfolio
  34. Toshiba Launches Illumination LED Driver IC with Single-Wire Input
  35. ROHM Expands Its Color Lineup of Class-Leading Thin, Compact LEDs
  36. Mouser Introduces Ecliptek's 1.2MM X 2.0MM 32.768kHz Crystal Designed for the IoT Rev
  37. Silicon Labs Multiband Wireless Gecko SoCs Break New Ground in the IoT
  38. New Battery-Charger Chip from STMicroelectronics Reduces Cost and Time-to-Market for
  39. Allegro MicroSystems, LLC Announces New Three-Wire, True Zero-Speed, Surface Mount Ma
  40. Lumileds Expands and Improves Its Award Winning LUXEON C Color Line
  41. Microsemi Announces New Development Kit with RTG4 PROTO FPGAs, Providing Space Design
  42. TI introduces the industry's highest performing reinforced isolated amplifier
  43. Aquantia Announces Market Expansion with Breakthrough Second Generation Multi-Gigabit
  44. Microchip Launches the Lowest Power, Cost-effective PIC32 Family with Core Independen
  45. MediaTek Launches Helio X20 Development Board for Advanced Product Creation Across Ma
  46. Qualcomm announces 5G NR sub-6 GHz prototype system and trial platform
  47. Alliance Memory Launches New 256M High-Speed CMOS SDRAMs in the 86-Pin TSOP II Packag
  48. IXYS Announces High-Speed Gate Driver for Isolated Drive Applications with up to 4KV
  49. Toshiba Launches the Industry's Leading-class Low On-resistance Small-size N-Channel
  50. Cadence Debuts PSpice Web Portal and Ecosystem to Help Designers Address System Level
  51. Microchip Announces Next-Generation Bluetooth® Low Energy Solutions with Easy-to-Use
  52. Achronix Introduces the Highest FPGA Memory Bandwidth, PCIe Acceleration Board for Da
  53. Cree Expands Portfolio of LEDs for Horticulture Lighting
  54. Molex Features Two Key Polymicro Technologies™ Tubing Products at HPLC 2016
  55. Cypress Enables IoT Developers to Easily Create Tiny, Solar-Powered Sensor Beacons th
  56. TI introduces the industry's lowest-power, low-jitter retimers for 4K UHD video and c
  57. Marvell Introduces the Cost-Effective, High-Performance ARMADA 8040 Networking Commun
  58. Qualcomm Announces Broad Support for Galileo Across Snapdragon Processor and Modem Po
  59. Bosch Sensortec Launches the World's Smallest 9-axis Motion Sensor
  60. Samsung Introduces New Line-up of LED Components for Automotive Lighting, Featuring C
  61. TI introduces 1.2-mm2 FemtoFET 60-V N-channel power MOSFET with industry's best resis
  62. Alma Technologies Adds Three New Ultra High Throughput H.264 Encoders to its UHT™ IP
  63. Renesas Electronics Develops Two-Port On-Chip SRAM Specialized in Improving Video Pro
  64. Xilinx Broadens the Zynq UltraScale+ MPSoC Family with Streamlined Dual-Core Devices
  65. Cypress Introduces New Programmable Analog SoCs for Embedded IoT Applications with Mu
  66. Data I/O Expands Presence in Asia-Pacific Region Through Distribution Partnership Wit
  67. Panasonic Launches an Inrush Low-Profile Relay Suited for Remote Control of Smart Swi
  68. Diamond Microwave Launches Feature-Rich GaN X-band SSPAs
  69. Peregrine Semiconductor Introduces the First High Frequency RF SOI Mixer
  70. Renesas Electronics America to Showcase IoT Design Innovation at the Internet of Thin
  71. Synopsys Launches Pre-Wafer Simulation Solution to Reduce Semiconductor Process Devel
  72. Synopsys Expands Software Integrity Strategy to Enable Development of Safer and More
  73. TI unveils industry's highest power density 12-V, 10-A, 10-MHz DC/DC converter
  74. Analog Devices Simplifies Wireless System Design with RadioVerse™ Technology and Desi
  75. Xilinx Expands its 16nm UltraScale+ Product Roadmap to Include Acceleration Enhanced
  76. Fairchild’s Integrated Circuit LED Lighting Solutions Simplify Development of Smart L
  77. Allegro MicroSystems, LLC Introduces New Quad DMOS Full Bridge PWM Motor Driver IC
  78. New Bluetooth Enabled Smart Tweezers LCR- and ESR-meter from Siborg Systems Inc.
  79. IoT Developers Kit Based on NXP(R) i.MX 7D MPU and ROHM's BD71815GW PMIC
  80. Microsemi Announces RTG4 PROTO FPGAs to Enable Lower Cost Prototyping and Design Vali
  81. Timesys Launches LinuxLink 5.0 Support for the Boundary Devices Nitrogen7
  82. TI delivers the industry's first RF sampling 14-bit, 3-GSPS analog-to-digital convert
  83. New Addition to IDT's FemtoClock Family Delivers Unparalleled Frequency Flexibility f
  84. Lumileds Upgrades its Most Cost Effective Solution for Spotlights and Directional Lam
  85. Fairchild Launches New Discrete and Bare Die IGBTs for Hybrid and All-Electric Vehicl
  86. ON Semiconductor Further Extends Scope of IGBT Offering with 1200 V Devices Based on
  87. Si2 Launches Project to Develop New Integrated Circuit Power Modeling Technology
  88. Conexant Introduces New Family of USB-C Audio CODECs, Redefines Possibilities for Aud
  89. InvenSense Announces World’s First TDM Microphone With an Array of 16 Devices on a Si
  90. Littelfuse Introduces SiC Schottky Diodes with Negligible Reverse Recovery, Enhanced
  91. World’s Smallest Native 4K Imaging Device Introduced by Compound Photonics at the Dis
  92. Cypress's New Family of Programmable Oscillators Deliver Industry-Leading Performance
  93. Revolutionary SCALE-iDriver ICs from Power Integrations Introduce High-Reliability SC
  94. Cambridge CMOS Sensors Launches µBright® - Highly Efficient, Robust Infrared Sources
  95. Credo 16-nm 28G and 56G PAM-4 SerDes Now Available on TSMC FinFET Compact Process
  96. Microchip Introduces Hardware Cryptography-Enabled 32-bit Microcontroller for Interne
  97. Allegro MicroSystems, LLC Introduces New 1 MHz Bandwidth, Integrated Hall-Effect-Bas
  98. Semtech Announces the Industry’s First Single Chip Hybrid PLC and LoRa® Wireless Plat
  99. Skyworks Introduces Next Generation Wi-Fi Solutions
  100. Sifos Technologies Introduces the Next Generation PoE Powered Device...
  101. Cavium Unveils OCTEON TX™: Industry's widest range of 64-bit ARM®-based SOCs for a br
  102. IXYS Announces the Expansion of Power Schottky Diodes in the Surface Mount Package DP
  103. Toshiba Launches Current-Feedback 4ch Power Amplifier IC for Car Audio with Built-In
  104. Greenlite Introduces LEDX Filament Series
  105. Heidelberg Instruments Introduces the Next Generation Laser...
  106. Synopsys Delivers Industry's First MIPI I3C IP for Sensor Connectivity Targeting IoT
  107. New Magnetic Position Sensors for Automotive Applications Support Full ISO26262
  108. Dialog Semiconductor Smart Lighting Dual-Dim(TM) LED Driver Provides Single-Chip TRIA
  109. Sharp launches smartphone-robot hybrid RoBoHoN powered by Snapdragon
  110. Panasonic Launches "PA-N Relay" Suitable for Programmable Logic Controllers
  111. Introducing the Approach® X40: the first golf-specific activity tracker band from Gar
  112. Cree Reinvents Light Experience with New TrueWhitePlus Technology
  113. Peregrine Semiconductor Expands MPAC-Doherty Product Family to Support GaN Power Ampl
  114. ISF -Development Tools : Mediatek launches Linkit SDK with RTOS
  115. New High-Performance LED Curing Solutions From Phoseon Technology Offer 16W/cm2 Peak
  116. Broadcom Announces Volume Production of Quad-core 64-bit 2GHz ARMv8 SoCs
  117. Molex Introduces SST™ PB3-CPX Modules for PROFIBUS Controllers
  118. Peregrine Semiconductor Expands MPAC-Doherty Product Family to Support GaN Power Ampl
  119. Semtech Extends 12G UHD-SDI Cable Reach Benchmark at NAB Show 2016
  120. Lattice Expands Award-Winning MachXO3™ Product Family
  121. Microsemi Enhances Radiation-Tolerant Space Product Portfolio with New LX7710 Diode A
  122. Xilinx Extends SmartConnect Technology to Deliver 20 -- 30% Breakthrough in Performan
  123. ViXS Announces GRD3 -- the Third Generation Golden Reference Decoder for Broadcast St
  124. Toshiba Launches ARM® Cortex®-M3-Based Microcontrollers With Latest 65nm Flash Embedd
  125. Toshiba Launches Opto-Isolated IGBT Gate Pre-Driver IC for In-Vehicle Inverters
  126. Tiny Camera for Quadcopters, Robots or Survelliance
  127. MACOM Introduces 2nd Generation 12G-SDI Equalizer Family for Broadcast Video Applicat
  128. Humavox® Brings New Smart Wireless Charging Technology to Hearing Aids, Wireless Earb
  129. Renesas Electronics Announces Industry-First Power Supply IC Supporting the Power Rul
  130. Renesas Electronics Delivers USB Power Delivery Controller Supporting USB Power Deliv
  131. Tortuga Logic's New Hardware Security Assessment Service Identifies Security Vulnerab
  132. Advantech Boasts 4-Channel 4K HEVC Encode in 1RU and Launches New Series of Applicati
  133. Broadcom Introduces Enterprise 5G-HD WI-FI Platform for Next-Generation Enterprises
  134. IXYS Integrated Circuits Division Announces New High Voltage Dimmable LED Driver IC
  135. Cree Introduces the Next Generation of XLamp XP-G Platform
  136. Osram increases the luminous efficacy of white and blue high-power LEDs by 7.5 percen
  137. Jaguar Land Rover Launches Technology Start-Up
  138. Realtek Announces End-to-End FTTdp Solution with 212MHz G.fast Solution
  139. SanDisk Doubles the Performance of InfiniFlash™ System, Further Defining the ‘Big Dat
  140. New MediaTek Helio X20 Features 10 Cores for Optimum Performance
  141. Semtech Expands RailClamp® Platform with RClamp0534N – a 5V, High-Surge Transient Pro
  142. Renesas Electronics Delivers RH850/E1M-S2 32-Bit MCUs for Improved Automobile Fuel Ef
  143. Renesas Electronics Reveals RX24T Group of 32-Bit MCUs Targeted to Motor Control for
  144. Cognitive Systems Corp. Announces Home Monitoring System Will Be Available by End of
  145. Allegro MicroSystems, LLC Announces New High-Accuracy, High-Isolaton, Differential Cu
  146. Lumany Introduces 400W Infrared Laser Module Series
  147. STMicroelectronics Accelerates STM8 Sales past Two Billion Units, Boosting Share of W
  148. Ixia Sets the Pace for Delivering Production-Ready 100/50/25 Gigabit Ethernet (GbE) T
  149. TI introduces chokeless high-speed CAN transceiver families with industry-leading EMC
  150. Embratel introduces M2M platform for connected car
  151. Evoqua Launches New Advanced Ultrapure Water Technology Facility in Rockford, IL
  152. Omron Releases New XW4 2.54mm Pitch Terminal Block Connectors
  153. New Cypress Evaluation Kit for PSoC and Flexible MCU Families Speeds Design of CAN an
  154. IDT Expands Power Portfolio with New Dual-Phase High-Performance Digital Power Contro
  155. Toshiba Launches Bipolar 2-channel Stepping Motor Driver with Maximum Rating of 40V a
  156. Ultratech Receives Multiple-System Order For Its Superfast 4G+ Inspection System
  157. Lumileds New LED Demonstrates Superior Resistance to Harsh Environments
  158. IXYS Introduces New Cylindrical Low Frequency, Half-Duplex Read-Only Radio Frequency
  159. Advantest Announces New T5830 System for Cost-Efficient Testing of High-Volume, Cost-
  160. Toshiba Adds to Line-up of DMOS FET Transistor Arrays with 1.5A Sink-Output Driver
  161. MagnaChip Surpasses 6 Million Display Driver ICs Shipped for OLED TV
  162. Toshiba Launches H Bridge Driver IC for Low-Voltage (2.5V) Drive
  163. A walk through of the Microarchitectural improvements in Cortex-A72
  164. Transphorm introduces the industry's only fully-qualified 650V GaN FET with the lowes
  165. Semtech Announces Initial Production Release of Quad 25Gbps Chipset for 100G SR4 Opti
  166. Renesas Electronics Reveals RX24T Group of 32-Bit MCUs Targeted to Motor Control for
  167. Embedded World 2016 - Toradex - iMX 7 System on Modules
  168. Toshiba Launches ARM® Cortex®-M3-based Microcontrollers with Latest 65nm Flash Embedd
  169. STMicroelectronics to Showcase Latest Innovative Internet-of-Things Enabling Solutio
  170. Power Integrations Serves Industrial and Three-Phase Power Supply Applications with N
  171. Cree Announces Essentia LED Flat Panel Troffer and Track Light Product Lines
  172. Allegro MicroSystems, LLC Announces New DMOS Microstepping Driver with Translator and
  173. Broadcom Introduces Industry’s Longest Reach 28Gbps Repeater ICs for Network Backpla
  174. Broadcom Delivers Industry’s Broadest Portfolio of Optical Components for MMF and SMF
  175. MitySOM-335x: ARM Cortex-A8 with NEON SIMD Coprocessor SOM
  176. TI introduces the world’s first microcontroller with a configurable low-leakage trans
  177. New Cree XLamp CXA2 High Density LEDs Double Lumen Output
  178. New Lumileds Matrix Platform Offering Simplifies Indoor Fixture Design
  179. Acacia Communications Introduces CFP2-ACO Module Based on Its Silicon PIC
  180. ams Releases Interoperable PDK for Its 0.35µm Analog Specialty Processes
  181. Inphi Unveils Highly Integrated Silicon Photonics Technology Platform for 100G Data C
  182. KYOCERA Strengthens IoT Business Through Expansion of Software Laboratory
  183. IXYS Announces the Expansion of Its Diode Phase-Leg Module With Record Current Rating
  184. NeoPhotonics Introduces High Power DFB Lasers for 100G Silicon Photonics Applications
  185. Analog Devices Launches Anveshan 2016 IoT Design Fellowship Program
  186. Violin Memory and Stream Financial Launch FlashSync for Ultra-high-performance Data A
  187. Dialog Semiconductor's Qualcomm(R) Quick Charge(TM) 3.0 Chipset Extends Company's Lea
  188. RRAM Leader Crossbar Enters China Memory Market
  189. Broadcom Announces Complete End-to-end Optical PAM-4 Platform for 40/100/200/400GbE D
  190. Altera Demonstrates Dual-mode 56-Gbps PAM-4 and 30-Gbps NRZ Transceiver Technology fo
  191. Pericom Delivers Industry First USB 3.1 Gen 2 USB Type-C Solution Supporting DisplayP
  192. Fairchild’s Next-Generation PowerTrench MOSFETs Deliver Best-in-Class Performance
  193. GigOptix Announces Introduction of Complete 28G/100G Chipset Portfolio for Short Reac
  194. Microchip Offers Lowest Profile 5A Power Module for Telecom, Industrial and SSD Appli
  195. Spreadtrum LTE SoC Platform Powers SM-J320F / DS Samsung Galaxy J3 Smart Phones
  196. Innovative wide Vin DC/DC controller features industry's highest 65-V operation
  197. ClariPhy's LightSpeed-II Coherent SoC Awarded Perfect Score in Prestigious 2016 Light
  198. Infinera Introduces Next Step Function in Optical Networking With the Groundbreaking
  199. MaxLinear Targets 100Gbps Small Form Factor Optical Transceivers with New MxL9101 TIA
  200. Snapdragon Wear, Nixon team up to power next wave of action smartwatches
  201. Altera Targets Next-Gen 500Gbps-1Tb Optical Transport Networks
  202. Xilinx Debuts Multiple Industry-First Solutions for Ultra-High Bandwidth Optical Netw
  203. Broadcom Demonstrates Industry-leading PAM-4 PHY Chips Supporting 40/100/200GbE over
  204. MACOM Announces Volume Shipments of PMD Chip-Set for 100Gbps Short Reach Applications
  205. Analog Devices’ Low Dropout Regulators Enable Cleaner and Faster Communications
  206. Ultra-Low Forward Voltage Drop Schottky Barrier Rectifier from Littelfuse Outperforms
  207. STM32F7 Discovery Board Programming and STM32CubeMx
  208. Mattson Releases 200MM Helios XP as Part of a Suite of New Services Focused on Intern
  209. BPM Microsystems Launches New 9th Generation Programmers at APEX 2016
  210. Eaton FP1110V Flat-Pac Power Inductors
  211. Tensorcom*Introduces a New 802.11ad 60 GHz*System on Chip (SoC) with Integrated USB 3
  212. Peregrine Semiconductor's New DOCSIS 3.1 RF Switch Sets High Linearity Record
  213. IXYS Introduces High Performance Copack IGBT and Diode in the ISO247 Package with Low
  214. Xilinx Delivers the Industry's Most Flexible and Comprehensive Ethernet Portfolio for
  215. Lumileds LUXEON 2835 Line Delivers Perfected Performance, Built on a Proven Legacy
  216. New Performance Oscilloscope Probes Tackle Today's Smaller, Faster Designs
  217. Renesas Electronics America Showcases Cockpit and Autonomous Driving Solutions at Con
  218. Cypress Unveils a Bluetooth Low Energy Module with 400-Meter Range and a Module with
  219. Inphi Announces Sampling of Next-Generation 45Gbaud SMT Quad Linear Coherent Driver a
  220. Microsemi Announces New Secured FPGA Production Programming Solution to Prevent Overb
  221. Edwards Launches New Vacuum Pumps for Semiconductor and Flat Panel Manufacturing at S
  222. STMicroelectronics Embraces New Digital Age in China
  223. Lattice Semiconductor and MediaTek Deliver the World’s Most Power Efficient 4K Video
  224. Grandstream Launches Cloud-based Video, Audio and Web Conferencing Service
  225. SiTime Introduces Smallest, Most Stable 32 kHz Super-TCXO with In-System Auto-Calibra
  226. Qualcomm Announces Introduction of Snapdragon Virtual Reality Software Development Ki
  227. Samsung Introduces Full Line-up of LED Components Based on Chip-Scale Packaging Techn
  228. ISF -IOT :Samsung lauches Smart Lighting Module for Connectivity in IoT
  229. SiTime Introduces Smallest, Most Stable 32 kHz Super-TCXO with In-System Auto-Calibra
  230. Samsung Adds Advanced Color Quality Features to its Small LES, Chip-on-Board LED Solu
  231. Renesas Electronics Introduces 8th-Generation IGBTs that Improve System Power Efficie
  232. nLIGHT Announces 1200 W Single-Mode Fiber Laser at Laser World of...
  233. Analog Devices’ ARM-based Cortex-M3 microcontroller targeted for IoT, study reveals n
  234. Toshiba Debuts New 2-in-1 MOSFETs for Load Switching in Mobile Devices
  235. IXYS Integrated Circuits Division Introduces New 800V Solid State Relay
  236. For High speed communication in Between ARM Micro controller a IA-32 based Micro Proc
  237. Redpine Signals Announces Availability of FIPS 140-2 Certified Wi-Fi Modules for Gove
  238. Molex Debuts Nano-Pitch I/O™ 80-Circuit Interconnect at DesignCon 2016
  239. New Samsung Exynos 7 Octa 7870 brings premium performance to mass market mobile
  240. MACOM Announces Industry’s First CWDM4 L-PIC™ for 100G Datacenter Applications
  241. Allegro MicroSystems, LLC Announces Unique LED Driver With Integrated Hall-Effect Swi
  242. Cree Boosts Performance of Industry-Leading XLamp XP LEDs
  243. Lumileds Releases New LUXEON 3535L HE Plus to Enable Most Reliable, High Efficiency T
  244. Si-Ware Systems Launches Volume Production of NeoSpectra Sensor for Material Analysis
  245. ORBCOMM Launches M2M Cargo Monitoring Solution
  246. Silego Introduces its First High-voltage, 5 A, Feature-rich Integrated Power Controll
  247. Cree Reinvents the LED Residential Streetlight with New RSW Series
  248. New LYTSwitch-3 LED Driver ICs From Power Integrations Support Widest Range of TRIAC
  249. TI introduces industry's highest-performance wideband RF phase-locked loops with inte
  250. Semtech Launches Online Support Community Platform to Help Engineers Quickly Find and